Thermal Grizzly Minus Pad 8-100x100x1.0mm Thermal Interface Pad, Electrically Non-Conductive, High Thermal Conductivity & Compressibility for SSDs, GPUs & Electronics
Product details
| Management number | 212164918 | Release Date | 2026/04/06 | List Price | $9.16 | Model Number | 212164918 | ||
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- THERMAL CONDUCTIVE PAD - It effectively dissipates significant amounts of heat thanks to its unique composition of Ceramic Silicone and Nano-Aluminum Oxide
- FLEXIBLE STRUCTURE - The thermal padding compensates for even the smallest gaps between components with its flexible structure and high heat conductivity
- USED IN VARIOUS SCENARIOS - It is utilized in situations where thermal paste cannot be applied, such as cases with large air gaps or uneven surfaces
- GREAT RESULTS - By filling small gaps with its flexible and highly conductive structure, the Thermal Pad effectively dissipates heat between components
- 8W/(m·K) THERMAL CONDUCTIVITY - With a highly conductive and versatile nature, it is suitable for a wide range of configurations with basic to high requirements
| UPC | 753677507326 |
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| Brand Name | Thermal Grizzly |
| CPU Socket | LGA 1200, AM4 |
| Unit Count | 1.0 Count |
| Item Weight | 1.44 ounces |
| Manufacturer | Thermal Grizzly |
| Mounting Type | Chassis Mount |
| Item Type Name | CPU-Cooler |
| Cooler Heatsink Material | Ceramic Silicone and Nano-Aluminum Oxide |
| Item Dimensions L x W x H | 3.94"L x 3.94"W x 0.04"H |
| Cooler Heatsink Compatibility | WIDE RANGE OF COMPONENTS |
| Global Trade Identification Number | 00753677507326 |
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Thermal Pads
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